Apple announced M1 Ultra, the next giant leap for Apple silicon and the Mac. Featuring UltraFusion — Apple’s innovative packaging architecture that interconnects the die of two M1 Max chips to create a system on a chip (SoC) with unprecedented levels of performance and capabilities — M1 Ultra delivers breathtaking computing power to the new Mac Studio while maintaining industry-leading performance per watt.
The new SoC consists of 114 billion transistors, the most ever in a personal computer chip. M1 Ultra can be configured with up to 128GB of high-bandwidth, low-latency unified memory that can be accessed by the 20-core CPU, 64-core GPU, and 32-core Neural Engine, providing astonishing performance for developers compiling code, artists working in huge 3D environments that were previously impossible to render, and video professionals who can transcode video to ProRes up to 5.6x faster than with a 28-core Mac Pro with Afterburner.
“M1 Ultra is another game-changer for Apple silicon that once again will shock the PC industry. By connecting two M1 Max die with our UltraFusion packaging architecture, we’re able to scale Apple silicon to unprecedented new heights,”
said Johny Srouji, Apple’s senior vice president of Hardware Technologies.
“With its powerful CPU, massive GPU, incredible Neural Engine, ProRes hardware acceleration, and huge amount of unified memory, M1 Ultra completes the M1 family as the world’s most powerful and capable chip for a personal computer.”
Today, Apple is carbon neutral for global corporate operations, and by 2030, plans to have net-zero climate impact across the entire business, which includes manufacturing supply chains and all product life cycles. This means that every chip Apple creates, from design to manufacturing, will be 100 percent carbon neutral.
