Mixx Technologies Inc., a trailblazer in silicon-integrated optical connectivity for artificial intelligence (AI) infrastructure, has announced the successful close of a $33 million Series A funding round. The oversubscribed investment was led by ICM HPQC Fund, with additional backing from TDK Ventures, Systemiq Capital, Banpu Innovation & Ventures, G Vision Capital, Ajinomoto Group Ventures, AVITIC Innovation Fund, and several other strategic partners—signalling strong global confidence in Mixx’s breakthrough technology.
Pioneering Optical Connectivity for the AI Era
Founded by the engineering leaders behind Intel’s silicon-photonics transceivers and Broadcom’s first-ever co-packaged optics (CPO), Mixx is tackling one of AI’s biggest infrastructure challenges: the interconnect bottleneck slowing down performance at scale.
Its Silicon-Integrated Optical Connectivity Platform merges photonics, advanced packaging, and full system-level architecture—delivering the bandwidth, energy efficiency, and parallelization needed for the exabyte-scale AI workloads of the future.
“The very metrics of performance are shifting,”
said Vivek Raghuraman, CEO and co-founder of Mixx Technologies.
“Our goal is to optimize end-to-end data movement across trillions of interconnected nodes, where every pico-joule saved and every nanosecond gained matters.”
The new capital will drive Mixx’s product milestones, global expansion, and the scaling of its R&D hubs across the U.S., India, and Taiwan.
HBxIO™: The Optical Engine Redefining AI Data Movement
At the center of Mixx’s vision is HBxIO™, a silicon-integrated optical engine that acts as the communication backbone for next-generation AI systems. Built on open standards and proprietary orchestration algorithms, HBxIO™ offers:
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Higher bandwidth
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Lower power consumption
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Reduced total cost of ownership
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High-radix connectivity for massive scale
Co-founder and Chief Product Officer Dr. Rebecca Schaevitz describes the approach as “transforming the path from transistor to fiber,” eliminating bottlenecks and flattening the data-center network.
Delivering System-Level Breakthroughs
Mixx’s optical platform unlocks several major performance and efficiency advancements:
Switchless AI Clusters
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Up to 4× higher port counts than copper-based CPOs
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32× improvement in compute efficiency thanks to flattened topologies
Next-Generation 3.5D Integration
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Direct-to-ASIC optical integration
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Up to 75% power savings and 2× lower latency versus current state-of-the-art
Composable, Disaggregated Infrastructure
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Dynamic interconnection of compute, memory, and accelerators
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True system-level scalability
Open Standards for Global Adoption
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Full interoperability with existing hyperscale environments
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Multi-protocol support designed for long-term, industry-wide compatibility
Investors Signal Strong Confidence in Mixx’s Vision
“AI connectivity is being rewritten right now,”
said Matthew Gould, Portfolio Manager at ICM HPQC Fund.
“Mixx’s team and technology place them years ahead of challenges others are only beginning to understand.”
TDK Ventures’ Tina Tosukhowong praised Mixx’s “pragmatic approach” to building scalable, manufacturable optical technologies for the AI era.
Systemiq Capital’s Irena Spazzapan and Jasper Wigley highlighted the platform’s alignment with sustainability demands, calling it “technology arriving at exactly the right moment.”
At G Vision Capital, Dr. Luke Tang noted that connectivity—not compute—is becoming the limiting factor for AI inference. “Mixx removes those bottlenecks and unlocks higher-utilization AI systems.”
